ADS-S / Automatic Dicing Saw - Scribing

Dicing is the process of cutting processed / unprocessed semiconductor, glass or ceramic substrates into individual units (dies). Both mechanical sawing (blade dicing) and scribing/breaking (dry environment) are available. Regarding blade dicing, the substrate is typically mounted on a metal frame with a sticky tape. Different factors like substrate size, thickness and material, cutting streets determine the dicing parameters including blade selection. DI water is dispensed along the blade trajectory to wash away particles and provide lubrication and cooling.

Tool

Allied High Tech Production Inc. – Techcut 5

Applications

Cutting of semiconductor, glass or ceramic substrates

Substrate Size

4” wafer or smaller

Cutting Specifications

Blade Range: Diameter: 3" - 8" (76 - 200 mm), Arbor Hole: 0.5" or 1.25" (12.7 or 32 mm)
Flange Size: 2" (51 mm) & 3" (76 mm) included
Sample/Cutting Capacity: 6" W x 6" L x 2.5" H (152 x 152 x 64 mm)
Y-Axis Table: 8" (203 mm) travel - manual or programmable cut-depth of 0.05" - 3" (1 - 76 mm) per minute
X-Axis Table: 4" (102 mm) travel, 5 µm or 25 µm increments with zeroing dial
T-Slot Table: 7.75" D x 8.25" W (195 x 210 mm) with four (4) channels

Additional Information

Mixalis Sfendourakis, sfend@physics.uoc.gr

Tool

LatticeGear -Flipscribe

Applications

Cutting of semiconductor, glass or ceramic substrates

Substrate Size

4” wafer or smaller

Cutting Specifications

Enables accurate cleaving through front side targets with a scribe made on the backside of the substrate. Scribe does not damage the front side of the sample.
Scribe accuracy: ± 200 μm
Flexible with respect to sample size and shape. Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving.
Accurate positioning of the scribe relative to features on the front side (the front side being observed either by eye or with a stereoscope). The length of the scribe can be varied from 1 to 100 mm. Ruler embedded in platform enables precise and repeatable sample alignment and sizing.

Additional Information

Mixalis Sfendourakis, sfend@physics.uoc.gr

Tool

DISCO DAD 321

Applications

Cutting of semiconductor, glass or ceramic substrates

Substrate Size

Up to 6” in diameter

Cutting Specifications

Uses of rotating diamond blades in a wet environment
Kerf width : from 0.035 to 0.4mm depending on substrate materials and thickness
Cutting depth: up to 3 mm
Cutting speed: 1 – 100 mm/s
Spindle speed: 30.000 rpm
Position accuracy: < 8 µm (accumulated from 10 line cuts on 4” wafer)

Additional Information

Dr. Vassilis Vamvakas, v.vamvakas@inn.demokritos.gr

Ask for more information on availability,dates and pricing Submit Your Query
provided at Innovation-el by:
IESL/FORTH Heraklion