EP / Electroplating
Electroplating consists in the electrolytic deposition of metals onto a conductive or semi-conductive surface. The latter surface referred to as the cathode (negatively biased electrode) is immersed in an electrolyte solution containing the metal ions to be plated. The metal ions come from metal salts added to the solution, and from the anodic dissolution of sacrificial anodes (positively biased electrode), made of the same metal to be deposited on the cathode. An electric field applied between the two electrodes forces the positively charged metal ions to move to the cathode where they are reduced and deposited. The growth velocity and structural properties of the plated metal layer depend on parameters like the bath temperature and pH, the current density, the plating time, anode surface morphology, etc.
Innovation.el provides access to electroplating equipment for the deposition of Au, Ni & Cu layers with thickness in the range of 0.5 to 10μm. Such deposits are particularly suitable for applications in MEMS processing and semiconductor technologies.
Electroplating system / nb-technologies
Au, Cu, Ni
Up to 3 inch
NB SEMIPLATE AU 100, NB SEMIPLATE CU 100, NB SEMIPLATE NI 100
Up to 60oC
Au: 1 to 10mA/cm², Cu: 10 to 40 mA/cm², Ni: 10 to 30mA/cm²
From 0.5 to 10μm
Mr. George Stavrinidis (firstname.lastname@example.org) & Mr. Antonis Stavrinidis (email@example.com)