WB / Wire bonding

Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100GHz


Kulike and Soffa Industries Inc. Model 4123)


Gold 12-75μm, aluminum 25-75μm

Ultrasonic Power

Low: 1.3W, high: 2W

Other Specifications

DC servo/LVDT controlled bonding head, Build in, phase-locked loop U/S, with high Q transducer, Electronic settings for bonding parameters , Manual Z dual operating modes, Spotlight targeting, Stich bonding, Temperature controlled

Additional Information

George Stavrinidis, gstav@physics.uoc.gr

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